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  • PRICE$188.73
  • % CHANGE1.15%


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Sentiment (10 days)

  •  Strong Buy
  •  Buy
  •  Hold
  •  Sell
  •  Strong Sell


  • BullishBullish
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Smart Auto-Trading, our automated portfolio management platform, is designed to manage individual portfolios using the latest technology. Its proprietary system is designed to screens, monitors and invest in elite stocks like "ANSYS, INC. (ANSS)" using is unique Artificial Intelligence signals. It is designed to augment investors profit potential.

Smart Auto-Trading produces short-term trades which makes it an ideal tool for investing in tax-deferred accounts such as IRAs and Roth IRAs. If also works great in individual and joint taxable accounts. Just be aware that Smart Auto-Trading produces short-term investments that can be taxed at a different rates than long-term investments. Make sure you understand your tax situation before using Smart Auto-trading.

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There are clear benefits associated with using an automated portfolio management system such as Smart Auto-Trading to help you reach your financial goals. Smart Auto-Trading simplifies stock investing down to a few easy steps. It invests for you, using your personalized strategy, while you attend more important life events.

Using Smart Auto-Trading feels like having a professional Portfolio Manager working for you to help you reach your financial goals.

Smart Auto-Trading actively invests in the most positive components of the S&P 500® on your behalf. Its Artificial Intelligence signal takes into account emotional and rational indicators to provide key intelligence, 24/7. It 'trades on the news' taking advantage of price changes and trends by listening to market changes.

Smart Auto-Trading is one of the first automated management platform to take advantage of Government grade listening technology. It consumes market data and other specialized data feeds natively to produce a dynamic picture of the market.

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Disclaimer: Past performance may not be indicative of future results. Smart Auto-Trading, like other investment methods, rely on favorable market conditions to provide positive returns.


ANSYS Expands Its Solutions for TSMC Advanced Package Technology to Meet Growing Performance, Reliability and Power Demands

TSMC validates ANSYS® RedHawk™, ANSYS® RedHawk-CTA™ and ANSYS® CSM™ for TSMC Wafer on Wafer (WoW) and Chip on Wafer on Substrate (CoWoS®) advanced packaging technologies. The solutions include die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis and thermal analysis. CoWoS and WoW technologies enable smaller package size through multiple dies integration.

"Advanced packaging technologies will be the key driver for achieving extreme performance, high-system bandwidth and low power in leading-edge high-performance computing (HPC), cloud computing and automotive electronics systems," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The solution enablement with ANSYS supports customers performing advanced multi-die simulations to achieve their desired performance and reliability goals."

"Through exploration, prototyping and signoff, ANSYS' industry-leading solutions can be used across the entire design spectrum, from chip to package to system," said John Lee, general manager at ANSYS. "Close collaboration and partnership with TSMC ensures customers can design next-generation semiconductor chips with confidence."

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